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We have achieved a "mirror finish" on the inner surface by addressing the challenges associated with the small diameter of our unique technology, the "ultra-fine pipe."
<Grinding Results> Work Size: Outer Diameter 0.15φ x Inner Diameter 0.10φ (SUS304) Inner Surface Roughness: Ra0.051μm
Due to its small diameter, we have worked on improving the internal state that was considered a challenge and have achieved the "internal mirror surface."
We would like to introduce "Internal Mirror Polishing." With our unique technology of "Ultra-Fine Pipes," we have tackled the challenges associated with the internal surface condition due to their small diameter and achieved "Internal Mirror Finish." Please contact us for more information. 【After polishing, Ra 0.051μm】 ■Material: SUS304 ■Outer Diameter: φ0.15 ■Inner Diameter: φ0.10 ↓ ■Good internal surface roughness before polishing ■Directly leads to reduced polishing time ■Also suitable as a material with good internal roughness *For more details, please refer to the related link page or feel free to contact us.
Fully equipped with large-scale grinding processing equipment! We finish various materials to a mirror surface.
The optical single crystal mirror polishing technology has built a history since our founding. The ultra-precision polishing process based on this foundation can be said to be our pride. With a wealth of processing experience, we have established processing technology that is not limited by materials. We respond to various customer needs, from optical single crystals to metals and resins. 【Features】 ○ Ultra-large Oscar polishing machine (φ3500) Capable of Oscar polishing processes such as spherical and flat polishing, which require advanced skills. ○ Large lapping machine Supports large-scale polishing with polishing plate sizes of φ3200, φ2500, and φ2000. ○ Other lapping machines Extensively develops ultra-precision polishing for metals, ceramics, optical crystals, and new materials. Holds over 70 lapping machines with polishing plate sizes of 36 inches or less. Capable of both custom and mass production. ○ CMP equipment, etc. Supports chemical mechanical polishing (CMP polishing) for wafer surface flattening and finishing. Equipped with a high-cleanliness clean room, enabling high-value-added polishing processes. Contributes to the advancement of cutting-edge technologies in semiconductors and optical communications. ● For more details, please contact us or refer to our catalog.
